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0.13mm Substrate-free Thermal Conductive Tape

FYT-3T905HT

0.13mm Substrate-free Thermal Conductive Tape

FY-Acrylic polymer substrate-free thermal conductive tape is the most ideal adhesive for assembling between uneven surface structures; it is featured by high thermal conductivity, insulation performance, excellent flexibility, conformability, self-adhesiveness and high compression ratio. With a wide temperature range to adapt to working conditions, it is effective in all kinds of harsh institutional environment, and export the heat out of the electronic components.

product characteristic

●No color, clear pure glue tape

●Good initial adhesion and holding power

●High cohesion, good plastic resistance, excellent die-cutting performance

●No residue, excessive glue, stable chemical, organic solvent resistance




main application

Nameplate, label, logo: apply to mesh printing, advertising, aviation, medical and industrial equipment, automotive, household appliances, electronic markets and other industries

Soft plate FPC: apply to mobile phone, tablet, PDA, digital camera, LCM electronic product.

Thin film switch: contain soft, hard, uneven thin film switch


Shockproof foam: good initial adhesion and holding power, high cohesion, good plastic resistance



product characteristic:

• High adhesion, stable weather resistance, waterproof, good shockproof effect, not easy to rebond

• Good cutting property, satisfy the use need of mobile phone thin frame

• Not easy to separate layer when mold shaping, adopt super thin foam substrate double side tape to meet thin tape’s need.

• Satisfy whole machine drop down test, pull test, and roller test

main application:

• CPU and radiator fixed

• LED plate and structure fixed

• Electronic component and radiator fixed

The Features
model
FYT-3T905HT
thickness
0.13mm
stickiness g/inch²
1200
thermal conductivity(W/m*K)
0.5
width
1000mm
length
50m

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